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Implant-level connection: Direct fit to the implant
reducing bone stress and enhancing long-term stability
Its straight and narrow design makes it particularly advantageous in areas with limited space or in the aesthetic zone
The head design is the same with every system in the cap area and differs only in its features with relation to the implant
BIONIKA DI UF, Implant analog for digital scan Diameter:Ø 3 mm Implant-level connection: Direct fit toBrand characteristics The BIONIKA DI UF implant system is compatible with the DIO UF platform and features an advanced conical connection (Conical Connection) combined with a hexagonal fit, ensuring micromovement free load transfer and exceptional stability. The 22 cone angle directs forces deep into the implant body, reducing cortical bone stress and promoting long term osseointegration. The spirally micro grooved, self locking, and self compressing
